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Project title: Conduct engineering analysis in Solid Edge
Type of cooperation: One-time project
Section: Engineering. Drawings
Prepayment: without prepayment
Acceptance of requests: from 2024-02-26 until 2024-03-02
Type of cooperation: One-time project
Section: Engineering. Drawings
Prepayment: without prepayment
Acceptance of requests: from 2024-02-26 until 2024-03-02
Project description:
Conduct engineering analysis of the static thermal mode of the chips on the PP in the original location of Solid Edge. Optimize the location of the chips.
Conduct engineering analysis of the static thermal mode of the chips on the PP in the original location of Solid Edge. Optimize the location of the chips.
Attached files:
Attached files are available only to Freelancers and the project author
Attached files are available only to Freelancers and the project author
