Conduct engineering analysis in Solid Edge

Employer
[no-member:pro]Dmitry[/no-member:pro]
Project parameters
Type of cooperationOne-time project
SectionEngineering. Drawings
Prepaymentwithout prepayment
Acceptance of requestsfrom Feb 26, 2024 until Mar 2, 2024
Project description
Conduct engineering analysis of the static thermal mode of the chips on the PP in the original location of Solid Edge. Optimize the location of the chips.
Attached files
Files are available only to Freelancers and the project author